Device Processing

Kyma's technical team is ready to work with you to bring your III-N device ideas to life from concept, to layout, to reality. Utilizing a wide range of design and fabrication experience, Kyma can help with epi design, contact and dielectric schemes, as well as multi-level mask layouts.

We have access to a full suite of device processing facilities, supporting fabrication of all types of semiconductor devices including field effect transistors (FETs), Schottky barrier diodes, light emitting diodes (LEDs), and photoconductive semiconductor switches (PCSS). We can also validate your devices or films with routine materials characterization (XRD, AFM, XPS, SEM, etc) as well as electrical IV and CV measurements. Contact Kyma today to schedule a consultation with one of our design engineers.

Routine processing wafers up to 150mm diameter includes:

Lithography: Optical and E-beam lithography (sub-micron features)

Metals Deposition: EBeam Evaporation - Ag, Al, Au, Co, Cr, Ge, Mo, Ni, Pd, Pt, Ti; PVD Sputtering - Al, Au, Co, Cr, Cu, Fe, ITO, Ni, Ta, Ti, TiW, TiO2, W

Dielectric Deposition: PECVD - Nitride, Oxide and OxyNitrides; PE-ALD - Al2O3, HfO2, ZrO2, HfZrO2, TiN

Theremal Annealing: N2, H2/N2, Air, and Vacuum

Etch: Wet and dry etch (both -F and -Cl chemistry)