Device Processing

Kyma's technical team is ready to work with you to help translate your device ideas from concept, to layout, to device fab and test. Utilizing a wide range of design and fabrication experience, Kyma can help with epitaxial layer design, contact and dielectric schemes, as well as multi-level mask layouts.

Kyma has access to a full suite of device processing facilities, supporting fabrication of all types of semiconductor devices including field effect transistors (FETs), Schottky barrier diodes, light emitting diodes (LEDs), and photoconductive semiconductor switch (PCSS) devices. Kyma can also validate your devices or films with routine materials characterization (XRD, AFM, XPS, SEM, etc) as well as electrical (IV and CV) as well as advanced high-voltage laser-pulsed photoconductivity measurements.

Routine processing wafers up to 150mm diameter includes:

  • Lithography: Optical and E-beam lithography (sub-micron features)
  • Metals Deposition: E-beam Evaporation of Ag, Al, Au, Co, Cr, Ge, Mo, Ni, Pd, Pt, and Ti; PVD Sputtering of Al, Au, Co, Cr, Cu, Fe, ITO, Ni, Ta, Ti, TiW, TiO2, and W
  • Dielectric Deposition: PECVD of Nitride, Oxide and OxyNitrides; PE-ALD of Al2O3, HfO2, ZrO2, HfZrO2, and TiN
  • Thermal Annealing: N2, H2/N2, Air, and Vacuum
  • Etch: Wet and dry etch (both F and Cl chemistry)