Wafer Fabrication

Kyma Technologies offers a full line of substrate reclaim and wafer fabrication services, including crystallographic orientation, slicing, dicing, grinding, and polishing.

Kyma Technologies has over a decade of experience in fabricating crystalline wide bandgap semiconductor (WBGS) materials including GaN, AlN, Ga2O3, SiC, and sapphire. All of Kyma's substrate reclaim and wafer fabrication services are performed in-house in Kyma's fully equipped wafer fabrication facilities which include fixed abrasive diamond wire saws, custom built grinding tools, and a full suite of polishing tools for planarization, lapping, and chemical-mechanical polishing (CMP). Kyma's CMP processes create epi-ready surfaces with surface RMS of <0.5nm.

A particularly unique capability that Kyma has developed is that of controlling the detailed orientation including intentional mis-orientation (away from the primary orientation and towards a desired low index plane) of a crystalline wafer. Kyma applied these capabilities to several different crystals, including c-plane GaN, m-plane GaN, and more recently for mis-orienting Ga2O3 wafers in order to optimize the ability to grow high quality epitaxial device layers upon them. This capability provides benefits to customers interested in studying the effect of miscut for optimizing their epitaxial growth results.