Materials Characterization

Kyma customers benefit from Kyma's in-house suite of routine characterization tools plus Kyma's low-cost access to a number of advanced characterization tools in partner facilities in the Research Triangle Area.

Kyma's routine characterization capabilities include:

Thickness: Contactless measurements of semiconductor thin films ranging from 150Å to 450µm with sizes from 5mm x 5mm squares to 100mm in diameter.

Thickness & Bow: Contactless single-probe, multi-point thickness mapping and bow measurement of thin and thick films on substrates up to 4 inches in diameter.

Resistance: 1) Contactless, high-resistivity measurement of semi-insulating semiconductor bulk substrates ranging from 5x104 to 5x109 Ohm-cm with sizes from 10mm x 10mm squares to 150mm diameter and thicknesses between 350 and 650um. 2) Non-destructive measurement of sheet resistance, resistivity and thickness of semiconductor bulk substrates and thin films ranging from 0.035 to 3000 Ohms/square with sizes from 5mm x 5mm squares to 100mm in diameter.

Surface morphology: White light interferometer surface morphology mapping of thin and thick film substrates. Dimensions capability includes 1mm x 1mm to 4 inches in diameter.