Kyma has over a decade of experience in crystalline wide bandgap semiconductor (WBGS) materials including GaN, AlN, Ga2O3, SiC, and sapphire. Kyma's fully equipped wafer facilities include a full suite of polishing tools for planarization, lapping, and chemical-mechanical polishing (CMP).
Kyma's CMP processes create epi-ready surfaces with surface RMS of <0.5nm. Additionally, wafer dicing services are available for sizes down to 5mm x 5mm.
